PolyMide CoPA
PolyMide is a family of Nylon/polyamide based filaments. Produced with Polymaker’s Warp-Free™ technology, PolyMide™ filaments deliver engineering properties intrinsic to Nylon and ease of printing.
PolyMide CoPA is based on a copolymer of Nylon 6 and Nylon 6,6. The filament combines excellent strength, toughness, and heat resistance of up to 180˚C.
Does PolyMide™ CoPA requires an enclosed printer?
No, all our Nylon features our Warp-Free™ Technology which means it does not require a heated bed or heated chamber of more than 50˚C.
PolyMide™ CoPA can be printed on a 30-40˚C bed without enclosure.
Do you need to anneal PolyMide™ CoPA?
PolyMide™ CoPA displays outstanding mechanical and thermal properties when fully crystallized. The printed part will not reach full crystallization after the printing process, an additional step is required: Annealing.
You can anneal PolyMide™ CoPA by placing your part in the oven at 80˚C for 6h.
Printing Settings
Printing Temperature: 250˚C - 270˚C
Bed Temperature: 25˚C - 50˚C
Printing Speed: 30mm/s - 50mm/s
Fan: OFF
Direct Drive:
Retraction Distance: 3mm
Retraction Speed: 50mm/s
Indirect Drive:
Retraction Distance: 6mm
Retraction Speed: 60mm/s
Drying Settings: 80˚C for 6h
(Only if the material has absorbed moisture)
Mechanical Properties
Young's Modulus:
2223 ± 199 Mpa
Tensile Strength:
66.2 ± 0.9 Mpa
Bending Strength:
97.0 ± 1.4 Mpa
Charpy Impact Strength:
9.6 ± 1.4 kJ/m2
Thermal Properties
Glass Transition Temperature:
67.0˚C
Vicat Softening Temperature:
180.0˚C
Melting Temperature:
190.0˚C
